• Liquid Photosensitive Etching Resist Ink PR-8000 High Resolution Eco Friendly
Liquid Photosensitive Etching Resist Ink PR-8000 High Resolution Eco Friendly

Liquid Photosensitive Etching Resist Ink PR-8000 High Resolution Eco Friendly

Détails sur le produit:

Lieu d'origine: GangDong Chine.
Nom de marque: JIARUN
Numéro de modèle: PR-8000

Conditions de paiement et expédition:

Quantité de commande min: 200 kg
Prix: xiang tan
Détails d'emballage: 5KG/CANETTE ; 4 CANETTES / Carton ;
Conditions de paiement: T/T
Capacité d'approvisionnement: 10t/par semaine.
meilleur prix Parlez Maintenant.

Détail Infomation

Mettre en évidence:

Liquid Etching Resist Ink

,

photosensitive Etching Resist Ink

,

Eco Friendly photo sensitive ink

Description de produit

Liquid photosensitive etch resistance ink, belonging to screen printing ink, has high resolution and is suitable for manufacturing more precise circuits. It can also be used with spray etching or roller coating machines. Additionally, it is applicable to other materials such as copper, stainless steel (#8 mirror steel), and iron.

 

 

Product specifications:
   
Color: Indigo
solid content 60%
Viscosity: 100 ~ 150PS ± 20PS (VT-04, 25℃)
Curing conditions: Hot drying: 80℃ x 10 minutes
Exposure: 80 – 120mj/cm
Electroplating resistance: Resistant to copper sulfate, tin-lead, nickel, and various other electroplatings
Hardness of cured film: 2H (pencil hardness)
   
Work process:  
Pre-print surface treatment: cleaning, acid treatment, water washing.
Coating: screen printing, roller coating, spraying
Screen printing MESH: outer layer plating: 120-150 mesh; inner layer etching: 200-250 mesh
thickness: plating: 0.8-1.0 mil; etching: 0.4-0.6 mil.
Pre-baking: first side: 80°C x 10 minutes;second side: 80°C x 15 minutes.
Exposure conditions: 7-8 steps/STOUFFER 21-step exposure scale, outer layer plating: 100-120 mj/cm², inner layer etching: 80-120 mj/cm².
Developing: 1-1.2% sodium carbonate solution, temperature 28 ± 2°C, water washing pressure: 1.5-2.0 kg/cm², developing speed: 40-45 seconds.
Etching: ferric chloride or copper chloride acid etching bath.
Plating: general plating solution.
Stripping: 5-10% sodium hydroxide solution, temperature 40°C, 60 seconds.
Thickness: 10-15μm, 20-25μm.

 

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